• 2007 GFF, 2010 G1F , 2012 GF1 , 2013 Optical Bonding , 2014 Metal Mesh
  • ǰ / /
  • κ ŷڹ޴ ߷
  • - FPCB Artwork, Pattern ü
  • - Sample
  • - Sample м ȿ
  • Metal Mesh μ Ư
  • - о : Model ( 15 ̻ )

  • ü ߷ Optical Bonding Ÿ Ȯ
  • - Tooling Cost , ü 𵨿 ´ Modify
  • - Inch up , Capa up
  • TSP LCD Module ˻ ü
  • - ɺҷ Daily м Ͽ Know-how
  • ȿ Lay-out ȭ ̰

ǰ

κ

  • ǰ ŷڼ ŷڼ
  • ݵü Clean Room ü û 50Class ̸
  • ǰ ż Pilot Line ǰ / / Ȯ

ǰ System

  • ISO/TS - 16949 ȹ
  • ISO-9001, ISO-14001 ý İ ϰ ǰ ü Ȯ
  • ǰ 24ð м, 48ð ü Ҹ ׿ ż
  • Ͽ츦 96%̻ Ȯ

M , P Ÿ » 2% ̻

  • ǽð Monitoring ̻߻ Alarm ü
  • ˻ 80% ̻ ۾ ð˻ ߰˻
  • ˻ Ǹ κ åӰ οϿ
  • ˻ Ϻ Trend Ī , ͸
  • , ö ˼ (CTQ ) ǰ ǥȭ
  • CTQ (Critical To Quality) : ־ ǰ ū ġ ٽ Ư

TOUCH MOULE SCM پ缺 Ȯ

  • 2007 ~ 2014 츮& C TYPE : 50,000k
  • ITO ŷü : ÷ , Ͻ , SI , ÷ , Ƽ , , 佺Ʈ, PANASONIC , LGIT , ֻ , J-TOUCH , DNP , ʸ , MUTTO
  • WINDOW ŷü : LENS , Ż , ߽ , ڴ , ¡, dzؽ , κ , NK ENG , SG۷ι , AGT
  • FPCB ŷü : ̼÷ , ACT , , SI÷ , ÷ , ÷ , GDS

P , M ŷ ̷ S ܰ پ SCM డ

Solution Ȯ

  • Touch Module + Direct bonding ü SCM
  • İ Total solution ܼȭ : TSM , ,
  • ں ּȭ
  • - Capa 220K/, ڰȹ ( Capa 500K/ - 5 ҿ)
  • ü ߷ Optical Bonding Ÿ Ȯ

Ȯ ܰ Ȯ

  • Ȯ ( )
  • S M P 2% ̻ ܰ Ȯ
  • GFF , GF1 , G1F TYPE 뷮

츮 COST

ü ȭ ܰ ̹ϸ , M , P ŷ ̷ ִ SCM
Ǿ , Solution Ȯ ִ ܰ .
(M , P bidding BEST ü )