Competitive Edges
R&DCompetitive Edges
R&D Competitiveness
Technology Development
- GFF in 2007, G1F in 2010, GF1 in 2012, Optical Bonding in 2013, Metal Mesh in 2014
- Product designing / examining / producing capability
- Customer-confident technology R&D capability
- - FPCB Artwork, electrode pattern design technology
- - High sampling yield rate
- - Sample interim analysis and Improvement report
- Metal Mesh visibility improvement patent registered
- - Application model : large sized models (15)
Process Technology
- Outclass our competitors with self-developed process and optical bonding equipments
- - Tooling cost reduction, individual model modification
- - Rapid response capability, expandable production capacity
- Self-developed TSP and LCD Module functional testers
- - Accumulate improvement know-how through daily malfunction analysis
- Effective lay-out and mass production take-over through continuous process development
Quality Competitiveness
Strengths in process
- Retain verification devices for product reliability
- Maintain clean class under 50class by semiconductor process-level clean room facility
- Retain pilot product line design / examination / produce adaptability for new product line application
Quality management system per process
- ISO/TS - 16949 certification
- Post facto management and quality control through ISO-9001, ISO-14001 system
- Operate around-the-clock QA teams and 48hour emergency response system to handle customer claims and improvement demands
- Maintain 96% of production yield based on material and production process know-how
Secure production yield 2% higher than competitors (M., P. Co.)
- Defective alarm system through real time monitoring per process
- maintain 80% of production crew as qualified inspectors, initiate frequent random inspection
- Real-name inspector system for detection capacity improvement
- Daily inspector trend management, continuous monitoring
- Particularized inspection from raw-material (CTQ process classification applied) and product standardization management
- CTQ(Critical To Quality) Process : the major measurable characteristics affects to product quality the most
Price Competitiveness
Secure the diversity of SCM system composition for TOUCH MOULEs
- A total amount of Woori N Tech & HyunWoo Electronics C TYPE production from 2007 to 2014 : 50milion
- ITO clientele : Iljin Display, Ilshin electronics, SI, INTERFLEX, Tmos, Dongjin, Young Fast Optoelectronics, PANASONIC , LGIT, Nissha , J-TOUCH , DNP , FUJI FILM , MUTTO
- WINDOW clientele : LENS, VITAL, MAXPOD, Corning, Jingbo, Speenex, Jaemin View Tech, NK ENG, SG Global, AGT
- FPCB clientele : ISU Exaflex, ACT, Seil Electronics, SI FLEX, INTERFLEX, FlexCom, DaeDuck Electronics
various SCM system meets S. Co.s cost requirement can be applied with mass-production capacity collaborated with P. Co. and M. Co. and business backgrounds of ours
Provide post-process solution
- Capable to build up independent SCM system for touch module including direct bonding
- Post-process solution simplification : Reduction of TSM packing cost and logistics cost, capable to meet short term productions
- Indirect cost minimization based on facility investment
- - Production capacity of 220K/month currently, expansion investment reserved ( production capacity of 500K/month henceforward - expected to cost about 500 million won)
- Secure process competitiveness through self-developed optical bonding process.
Retain production cost competitiveness through stable production yield
- Secure stabilized high production yield rate
- Secure production yield 2% higher than competitors (S., M., P., TB., HI., DJ., N., TM., SK. Co.)
- Accumulated mass-production experiences and technique for GFF , GF1 , G1F TYPE
Woori N Tech cost competitiveness
Competitively low cost based on competitive SCM system built up through the business experiences with M. / P. Co. post-process solution and high production yield rate. (selected as the best bidder for M. Co., P. Co. production bid)