• GFF in 2007, G1F in 2010, GF1 in 2012, Optical Bonding in 2013, Metal Mesh in 2014
• Product designing / examining / producing capability
• Customer-confident technology R&D capability
• - FPCB Artwork, electrode pattern design technology
• - High sampling yield rate
• - Sample interim analysis and Improvement report
• Metal Mesh visibility improvement patent registered
• - Application model : large sized models (≥15”)

• Outclass our competitors with self-developed process and optical bonding equipments
• - Tooling cost reduction, individual model modification
• - Rapid response capability, expandable production capacity
• Self-developed TSP and LCD Module functional testers
• - Accumulate improvement know-how through daily malfunction analysis
• Effective lay-out and mass production take-over through continuous process development

• Retain verification devices for product reliability
• Maintain clean class under 50class by semiconductor process-level clean room facility
• Retain pilot product line design / examination / produce adaptability for new product line application

• ISO/TS - 16949 certification
• Post facto management and quality control through ISO-9001, ISO-14001 system
• Operate around-the-clock QA teams and 48hour emergency response system to handle customer claims and improvement demands
• Maintain 96% of production yield based on material and production process know-how

• Defective alarm system through real time monitoring per process
• maintain 80% of production crew as qualified inspectors, initiate frequent random inspection
• Real-name inspector system for detection capacity improvement
• Daily inspector trend management, continuous monitoring
• Particularized inspection from raw-material (CTQ process classification applied) and product standardization management
• CTQ(Critical To Quality) Process : the major measurable characteristics affects to product quality the most

• A total amount of Woori N Tech & HyunWoo Electronics’ C TYPE production from 2007 to 2014 : 50milion
• ITO clientele : Iljin Display, Ilshin electronics, SI, INTERFLEX, Tmos, Dongjin, Young Fast Optoelectronics, PANASONIC , LGIT, Nissha , J-TOUCH , DNP , FUJI FILM , MUTTO
• WINDOW clientele : LENS, VITAL, MAXPOD, Corning, Jingbo, Speenex, Jaemin View Tech, NK ENG, SG Global, AGT
• FPCB clientele : ISU Exaflex, ACT, Seil Electronics, SI FLEX, INTERFLEX, FlexCom, DaeDuck Electronics

※ various SCM system meets S. Co.’s cost requirement can be applied with mass-production capacity collaborated with P. Co. and M. Co. and business backgrounds of ours

• Capable to build up independent SCM system for touch module including direct bonding
• Post-process solution simplification : Reduction of TSM packing cost and logistics cost, capable to meet short term productions
• Indirect cost minimization based on facility investment
• - Production capacity of 220K/month currently, expansion investment reserved ( production capacity of 500K/month henceforward - expected to cost about 500 million won)
• Secure process competitiveness through self-developed optical bonding process.

• Secure stabilized high production yield rate
• Secure production yield 2% higher than competitors (S., M., P., TB., HI., DJ., N., TM., SK. Co.)
• Accumulated mass-production experiences and technique for GFF , GF1 , G1F TYPE